DTE 2027

MS037 - AI-Enhanced Computational Mechanics for Material Strength: Fracture Analysis and Material Modeling

Organized by: K. Arai (Tokyo University of Science, Japan), Y. Wada (Kindai University, Japan) and H. Okada (Tokyo University of Science, Japan)
Keywords: fracture analysis, material modeling, material strength
This mini-symposium focuses on recent advances in AI-enhanced computational mechanics for fracture analysis and material modeling for material strength. Topics of interest include fracture and crack propagation prediction, material constitutive modeling for damage and related phenomena, and the advancement of these approaches using AI technologies. Both fundamental and applied studies are invited to foster knowledge exchange and to promote the development of novel AI-enhanced computational frameworks.